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JIS C 6482:1997 (R2015)

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JIS C 6482:1997 (R2015)

Copper-clad laminates for printed wiring boards - Paper base, epoxy resin

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This Japanese Industrial Standard specifies the copper-clad laminates for printed wiring boards using paper base, epoxy resin (hereafter referred to as 'copper-clad laminates').

Author JSA
Editor JSA
Document type Standard
Format File
Confirmation date 2015-10-20
ICS 13.220.40 : Ignitability and burning behaviour of materials and products
31.180 : Printed circuits and boards
Number of pages 10
Cross references IEC 60249-2-3 (1987), MOD
Year 1990
Document history
Country Japan
Keyword JIS 6482;6482;JIS C 6482-1997