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The document gives the test methods, conditions and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board.
| Author | DIN |
|---|---|
| Editor | DIN |
| Document type | Standard |
| Format | File |
| Cancellation date | |
| Confirmation date | |
| expiration_de_validite | |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 12 |
| Replace | DIN IEC 52(CO)300 (1987-06) |
| Cross references | IEC 60249-3-3 (1991-04), IDT |
| Year | 1990 |
| Document history | DIN IEC 60249-3-3 (1994-06) |
| Country | Germany |
| Keyword | DIN IEC 60249;DIN IEC 60249-3;60249;DIN IEC 249-3-3 |