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Lapping, which is a subgroup of chip removal, is integrated into the system of manufacturing production processes and subdivided into individual processes. The individual processes belonging to lapping are defined.
| Author | DIN |
|---|---|
| Editor | DIN |
| Document type | Standard |
| Format | File |
| Cancellation date | |
| Confirmation date | |
| expiration_de_validite | |
| ICS | 01.040.25 : Manufacturing engineering (Vocabularies)
25.020 : Manufacturing forming processes 25.100.70 : Abrasives |
| Number of pages | 7 |
| Replace | DIN 8589-15 (1985-12) |
| Year | 2003 |
| Document history | DIN 8589-15 (2003-09) |
| Country | Germany |
| Keyword | DIN 8589;8589 |