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DIN IEC 61249-3-1:2008-05
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DIN IEC 61249-3-1:2008-05
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)More info
This PAS specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types.
| Author | DIN |
|---|---|
| Editor | DIN |
| Document type | Draft |
| Format | File |
| expiration_de_validite | 2008-07-31 |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 63 |
| Cross references | IEC 91/752/CD (2008-02), IDT |
| Year | 2008 |
| Document history | |
| Country | Germany |
| Keyword | DIN IEC 61249;DIN IEC 61249-3;61249 |