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JIS C 6515:1998 (R2014)

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JIS C 6515:1998 (R2014)

Copper foil for printed wiring boards

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$16.32

-55%

$36.27

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This specification gives requirements for properties of copper toil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.

Author JSA
Editor JSA
Document type Standard
Format File
Confirmation date 2014-10-20
ICS 31.180 : Printed circuits and boards
Number of pages 24
Replace JIS C 6511 (1992)
Cross references IEC 61249-5-1 (1995-11), IDT
Year 1990
Document history JIS C 6515 (1998-10-20)
Country Japan
Keyword JIS 6515;6515;JIS C 6515-1998