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DIN IEC/TS 62326-17 DIN SPEC 42326-17:2013-07
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DIN IEC/TS 62326-17 DIN SPEC 42326-17:2013-07
Printed boards - Part 17: Device embedded substrates - TEG (test element group) (IEC 91/1082/CD:2013)More info
This document describes the test element group devices useful in measurement of basic properties of device embedded substrates. Device embedded structures may embed various types of devices from passive, active and mechanical components.
| Author | DIN |
|---|---|
| Editor | DIN |
| Document type | Standard |
| Format | File |
| expiration_de_validite | 2014-01-08 |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 61 |
| Cross references | IEC 91/1082/CD (2013-01), IDT |
| Year | 2013 |
| Document history | |
| Country | Germany |
| Keyword | DIN IEC/TS 62326;62326 |