No products
View larger
New product
This document describes the basics of substrate embedding devices including but not limited to modules, integrated passive devices (IPD), micro electro chemical systems (MEMS), discrete component formed in fabrication process of electronic wiring board, and sheet form components.
| Author | DIN |
|---|---|
| Editor | DIN |
| Document type | Standard |
| Format | File |
| expiration_de_validite | 2013-09-29 |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 50 |
| Cross references | IEC 91/1081/CD (2013-01), IDT |
| Year | 2013 |
| Document history | |
| Country | Germany |
| Keyword | DIN IEC/TS 62326;62326 |