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JIS Z 3198-3:2003 (R2013)

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JIS Z 3198-3:2003 (R2013)

Test methods for lead-free solders - Part 3: Methods for spread test

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This Standard specifies the method of spread test of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.

Author JSA
Editor JSA
Document type Standard
Format File
Confirmation date 2013-10-21
ICS 25.160.50 : Brazing and soldering
Number of pages 8
Replace JIS Z 3198-3 (2003-02)
Cross references GB/T 28770 (2012), NEQ
Modified by JIS Z 3198-3/ERRATUM 1 (2003)
Year 2003
Document history JIS Z 3198-3 (2003-06-20)
Country Japan
Keyword JIS Z 3198;JIS 3198;3198