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JIS Z 3198-6:2003 (R2013)
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JIS Z 3198-6:2003 (R2013)
Test methods for lead-free solders - Part 6: Methods for 45° pull test of solder joints on QFP leadMore info
This Standard specifies methods for 45 deg. pull test of solder joints on QFP lead to be used principally for wiring connection, components connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2013-10-21 |
| ICS | 25.160.50 : Brazing and soldering
|
| Number of pages | 8 |
| Replace | JIS Z 3198-6 (2003-02) |
| Cross references | GB/T 28770 (2012), NEQ |
| Year | 2003 |
| Document history | JIS Z 3198-6 (2003-06-20) |
| Country | Japan |
| Keyword | JIS Z 3198;JIS 3198;3198 |