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JIS Z 3198-7:2003 (R2013)
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JIS Z 3198-7:2003 (R2013)
Test methods for lead-free solders - Part 7: Methods for shear strength of solder joints on chip componentsMore info
This Standard specifies test methods for shear strength of solder joints on chip components by using lead-free solder to be used principally for wiring connection of electrical machining and apparatus, electronic apparatus, communication equipment or the like, wiring connection of components and the like.
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2013-10-21 |
| ICS | 25.160.50 : Brazing and soldering
|
| Number of pages | 8 |
| Replace | JIS Z 3198-7 (2003-02) |
| Cross references | GB/T 28770 (2012), NEQ |
| Year | 2003 |
| Document history | JIS Z 3198-7 (2003-06-20) |
| Country | Japan |
| Keyword | JIS Z 3198;JIS 3198;3198 |