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JIS C 6485:2008 (R2017)
New product
JIS C 6485:2008 (R2017)
Base materials for printed circuits - Paper base, phenolic resinMore info
This Japanese Industrial Standard specifies the requirements for properties of paper based phenolic resin copper-clad laminates of both economic and high electrical grades, in thicknesses of 0.8 mm up to 3.2 mm.
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2017-10-20 |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 16 |
| Replace | JIS C 6485 (1997-02-20) |
| Cross references | IEC 61249-2-1 (2005-01), MOD |
| Year | 2008 |
| Document history | JIS C 6485 (2008-08-20) |
| Country | Japan |
| Keyword | JIS 6485;6485 |