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DIN IEC/TS 61967-3 VDE V 0847-21-3:2015-08
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DIN IEC/TS 61967-3 VDE V 0847-21-3:2015-08
Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method (IEC/TS 61967-3:2014)More info
This part of IEC 61967 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This method provides a mapping of the electric or magnetic near-field emissions over the IC and is intended for use up to 6 GHz.
| Author | VDE |
|---|---|
| Editor | VDE |
| Document type | Standard |
| Format | Paper |
| ICS | 31.200 : Integrated circuits. Microelectronics
|
| Number of pages | 32 |
| Replace | DIN IEC/TS 61967-3 (2012-05) |
| Cross references | IEC/TS 61967-3 (2014-08), IDT |
| Weight(kg.) | 0.1544 |
| Year | 2015 |
| Document history | DIN IEC/TS 61967-3 (2015-08) |
| Country | Germany |
| Keyword | DIN IEC/TS 61967;61967 |