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JIS Z 3284-3:2014
New product
JIS Z 3284-3:2014
Solder paste - Part 3: Test methods for printability, viscosity, slump and tackinessMore info
This Standard specifies the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 18 |
| Replace | JIS Z 3284 (1994-03-01) |
| Cross references | IEC 61189-5 (2006-08), MOD
|
| Year | 2014 |
| Document history | JIS Z 3284-3 (2014-06-20) |
| Country | Japan |
| Keyword | JIS Z 3284;JIS 3284;3284 |