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JIS C 62137-4:2016
New product
JIS C 62137-4:2016
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devicesMore info
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| ICS | 31.020 : Electronic components in general
31.190 : Electronic component assemblies |
| Number of pages | 42 |
| Cross references | IEC 62137-4 (2014-10), IDT
|
| Year | 2016 |
| Document history | |
| Country | Japan |
| Keyword | JIS C 62137;JIS 62137;62137 |